Iinkcukacha eziKhawulezayo
1. Ukusebenzisa i-Dual Energy X-Ray Absorptimetry.
2. Ukusebenzisa iKhowuni ePhakamileyo kakhulu - iBeam kunye neTekhnoloji yokuThengisa iSurface.
3. Ngesantya soMlinganiso oPhakamileyo kunye nexesha elifutshane lokulinganisa.
4. NgeTekhnoloji yoKufanekisa kabini ukufumana uMlinganiselo ochanekileyo.
5. Ukusebenzisa i-Laser Beam Positioning Technique, Ukwenza i-Measuring Position ichaneke ngakumbi.
Ukupakishwa kunye nokuhanjiswa
| Iinkcukacha zokupakisha:Iphakheji yokuthumela ngaphandle eqhelekileyo Iinkcukacha zokuziswa: phakathi kweentsuku zokusebenza ezi-7-10 emva kokufunyanwa kwentlawulo |
Iinkcukacha
ITrolley yoBuchule beUltrasound Bone Densitometer Machine AMBD11
IParameter yoBugcisa:
1. Ukusebenzisa i-Dual Energy X-Ray Absorptimetry.
2. Ukusebenzisa iKhowuni ePhakamileyo kakhulu - iBeam kunye neTekhnoloji yokuThengisa iSurface.
3. Ngesantya soMlinganiso oPhakamileyo kunye nexesha elifutshane lokulinganisa.
4. NgeTekhnoloji yoKufanekisa kabini ukufumana uMlinganiselo ochanekileyo.
5. Ukusebenzisa i-Laser Beam Positioning Technique, Ukwenza i-Measuring Position ichaneke ngakumbi.
6. I-Dectcing Image Digitization, ukufumana iziphumo zoMlinganiselo ezichanekileyo.
7. Ukwamkela iTekhnoloji yokuJonga i-Surface, iMediaring Fast and Better.
8. Ukusebenzisa i-Unique Algorithms ukufumana iziphumo ezichanekileyo zokulinganisa.
9. Ukwamkela ifestile yoKhuseleko eValwe ngokuPheleleyo ukuba iMeta, kufuneka kuphela ukufaka ingalo yesigulana efestileni.Isixhobo luQhagamshelwano olungathanga ngqo kunye neCandelo lokuSkena lesigulana.Kulula ukusebenza kuGqirha.LuKhuseleko lwesigulane kunye noGqirha.
10. Ubume obukhethekileyo, inkangeleko entle kwaye kulula ukuyisebenzisa.
Umgangatho wokuSebenza:
1. Amacandelo oMlinganiso: Umphambili wengalo.
2. I-Pulse Dual Energy X-Ray ene-High and Low, Amandla aphezulu 85Kv, Amandla aphantsi 55Kv.
3. I-X-Ray Detector:Ikhamera yeDijithali eSensitivity ephezulu eNgaphandle.
4. Umthombo we-X-Reyi:Ityhubhu yeX-reyi eMisiweyo ye-Anode (ene-Frequency ephezulu kunye nokuGxininisa okuNcinci)
5. Indlela yokuBonisa: Ikhowuni – iBeam kunye neTekhnoloji yokuBonisa umphezulu.
6. Ixesha lomfanekiso: ≤ 5 Imizuzwana.
7. Ukuchaneka (impazamo)≤ 1％
8. Ukuphinda-phinda (impazamo)≤1％
9. IParameter yokulinganisa: Inqaku loXinano lweBone
10. Bala iparameter: T-Score, Z-Score
11. Ukusebenza: Ikhompyuter yeBrand, CPU ≥ 3.2G, iMemori ≥ 4G, HD ≥500G
12. Umbane osebenzayo: 220V ± 10%, 50Hz.
